Supermicro Superserver -F619P2-RTN

Description

Chassis / System Architecture

• 4U rack-mount “FatTwin” chassis.
• The chassis (Supermicro CSE-F418BC2-R2K20BP) supports 8 server nodes in a single 4U system — but note: F619P2-RTN is a node model.
• Designed for high-density compute: modular nodes for flexible scaling.  

CPU / Processor Support

• Each node supports 2 × Intel Xeon Scalable Processors, using LGA 3647 (Socket P).
• Compatible with 2nd Gen Intel Xeon Scalable (“Cascade Lake”) and earlier “Skylake” — depends on BIOS.
• Supports processors with TDP in the range of 70 W to 165 W.
• Dual UPI interconnect (up to 10.4 GT/s) between CPUs.
• Maximum core count per CPU: up to 28 cores (depending on CPU model).

Memory

• 12 DIMM slots per node.
• Supports RDIMM or LRDIMM DDR4 ECC memory.
• Maximum memory capacity (per node): up to 3 TB with 3DS LRDIMMs.
• Memory speeds: supports up to DDR4-2933 MHz (for certain configurations) Also supports Intel Optane DCPMM (Persistent Memory) on supported CPUs.

Storage / Drive Bays

• For each node: 6 hot-swap 2.5″ SATA3 (6 Gb/s) drive bays.
• Alternatively, some configurations allow: 2 × 2.5″ SATA3 + 4 × NVMe U.2 drives.
• Also supports M.2 interface: PCIe 3.0 ×4, supporting 2260 / 2280 / 22110 sized M.2 modules.
• Backplane: SAS/SATA.

Expansion Slots

• Per node:
  • 1 × PCIe 3.0 x16 (low profile)
  • 1 × PCIe 3.0 x16 (for SIOM) — for Supermicro’s SIOM (small I/O module) networking.
• SIOM (Super I/O Module) allows flexible network card module choice.

Networking / Management

• SIOM network card slot gives flexibility for networking (various speed cards).
• Dedicated IPMI LAN port (remote management) per node.
• Baseboard Management Controller (BMC): ASPEED AST2500, supports IPMI 2.0, KVM-over-LAN / virtual media.

Power Supply

• 2200 W redundant power supplies (Titanium level, ~96% efficiency).
• Power configuration: multiple inputs supported (e.g., 200–240V).

Cooling / Fans

• Uses 3 × 4 cm (40 mm), 20k RPM fans in each node for cooling.
• Chassis-level cooling designed for high-density compute.

I/O / Ports

• Rear / node I/O:
  • 1 × VGA port
  • 2 × USB 3.0 ports
• System monitoring: CPU, chassis temperature, fan speeds, etc. via IPMI.
• BIOS: AMI, stored in a 128 Mb SPI flash EEPROM.

Form Factor Dimensions

• Chassis dimensions (4U): ~ 17.63″ (W) × 6.96″ (H) × 29″ (D).
• Weight: ~68 kg gross for full 4U chassis.

Reliability / Manageability

• IPMI + SuperDoctor 5 for remote health monitoring and management.
• Redundant PSUs + hot-swap drive support improves availability.
• Modular “FatTwin” node architecture helps with maintenance: you can service or replace individual nodes.

Use Cases / Ideal Workloads

• High-density compute clusters: Because the chassis supports many nodes, it’s ideal for compact data centers.
• Hyper-converged infrastructure (HCI): Each node has its own compute, memory, storage—suitable for virtualization.
• Enterprise workloads: Large memory (up to 3 TB/node) makes it good for in-memory databases, caching, big data.
• Persistent memory: With Optane DCPMM support, it’s good for workloads that need persistent memory.
• High-performance networking: With SIOM, you can choose 10/25/40/100 Gb networking cards (depending on SIOM model).

Pros / Strengths

• Very modular and scalable: FatTwin architecture makes it easy to scale compute.
• High memory density: 12 DIMMs + support for large LRDIMMs / Optane PM.
• Good storage flexibility: choose SATA SSDs or NVMe U.2 drives.
• Redundant PSUs and good cooling for reliability.
• Strong remote management via IPMI / SuperDoctor